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A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced 2.54 mm (a tenth of an inch) apart. PGAs are often mounted on printed circuit boards via two methods, through hole or by using a socket. PGAs are primarily used in applications that require more pins than what older packages such as the dual in-line package (DIP).
PGA variants
The plastic pin grid array (PPGA) and later flip-chip pin grid array (FCPGA)
- PPGA: Plastic pin grid array
- FCPGA: flip-chip pin grid array
- CPGA: Ceramic pin grid array
- OPGA: Organic pin grid array
See also
- Dual in-line package (DIP)
- Single in-line package (SIP)
- Zig-zag in-line package (ZIP)
- Ball grid array (BGA)
- Land grid array (LGA)
- Centered square number
Wikipedia content modification information:
- This page was last modified on 19 September 2008, at 08:50.
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